The patented technology is configurable for the complete series of force sensors, piezo strain transducers, and the new PBT Sensor™ technology from OES.  Utilizing the highly evolved signature analysis algorithms common to all OES crimp force monitor systems, these new systems provide a detailed analysis of crimp signatures.  Coupled with the highly sensitive PBT Sensor technology, manufacturers have radically enhanced monitoring capability on small gauge wire processing applications.

Simple operator screens in a graphic based PC environment, which supports multiple languages, makes for a very user friendly interface.  Enhanced user software, ForceView™, allows advanced data logging, configuration profile management and easy to use set-up tools. 

A range of models is available to the market to suit every wire processor’s needs:

> CFM4100™ and CFM4200™ – one and two channel stand alone models for 100% in-process monitoring for defective crimps; bench presses and automatic equipment
> CFM2100™ – 100% in-process monitoring integrated to automatic wire processing equipment
> CFM4000 3G Upgrade™ - cost effective processor board upgrade for existing CFM4000 one and two channel monitors brings these systems to current levels of advanced monitoring capability

This next generation of advanced crimp monitoring technology will be demonstrated at the Electrical Wire Processing Expo, May 21 & 22, in Milwaukee.  Stop by the OES Inc display at Booth#1207 to see this technology in action.

OES is an experienced leader with in-process quality monitoring technologies, entering it 28th year of expanding operations.  OES Inc. develops and deploys many extremely effective “in-process test and monitoring” solutions for a wide range of applications, including wire crimping, tube end-forming, crimp forming, riveting, and other pressing and forming applications.