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OES announces the demonstration of the next generation of crimp monitors at the Electrical Wire Processing Technology Expo, May 21 & 22, at the Midwest Airlines Center, Milwaukee, WI.
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London, ON – May 7, 2008
OES Inc. has been awarded Delphi’s 2008 Technology Pinnacle Award. The citation recognizes OES “for their ability to view problems as opportunities, focus their creative resources on innovation, and successfully bring new ideas to market.”
London, ON – April 23, 2008
OES Inc. received notice of their latest patent (US7,333,906 B2) for quality analysis using Cumulative Deviation Determination, which the company refers to as “CDA” and uses in their line of leading process variation monitoring systems for quality assurance in manufacturing.
The application of weather seals onto the wire introduces potential for quality defects including seal not present, incorrect seal orientation, and improper seal position on the wire. It is widely accepted that crimp force monitors and process monitoring solutions, regardless of brand, have limited capability for detection of these potential defects.
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